FCM 10000 - Flip chip bonding
The Mühlbauer high speed flip chip mounter FCM 10000 excels with its compact design and its high output yield and excellent cost-efficiency.
CMTI - Chip module testing system
The Tape Inspection and Electric Test System CMTI is used to perfom a fully automatic optical and electric inspection of the flip device on 35/super 35 mm tapes.
This system can be attached for in-line inspection to the Flip Chip Bonder FCM 10000 or can be operated as stand-alone system for off-line quality control.
