CML 200
Glue tape lamination system
Mühlbauer’s CML 200 is a highly reliable and efficient glue tape lamination system. As a product of the Mühlbauer "200" series, the CML 200 excels with a standardized setup, produced in large lots. This results in a very competitive price.
Cost-efficient lamination of glue tapes
Highly flexible solution for various IC module applications
Best processability with heating from top and bottom
Sensor and mechanically controlled module tape transport
Tool change within seconds without removal of module tape
Best cost-of-ownership ratio
Throughput of up to 7,500 UPH
Suitable for a wide range of IC module tapes (standard as well as Dual Interface)
Your applications
Standard IC modules
IC modules for Dual Interface cards
