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DB 2008 SC Plus

Die Bonding

 
 
 
 
 
 
 

Description

 
 

The Die Bonder DB 2008 can handle different types of endless Smart Card tapes. It handles 6" to 12" (300 mm) wafers and guarantees repeatable constant die bonding quality, independent of the user. A compact in-line curing oven guarantee best performance due to individual heating zones.

 

The ultra fast vision system and the enhanced pick & place with its innovative Constant Force Bond Head offer an incredible increase in performance, product quality and yield. With its ergonomically designed human machine interface the Die Bonder 2008 is the most operator-friendly machine available.

 
 

 
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Last modified:08/03/2010
© 2011 Mühlbauer Holding AG & Co. KGaA, Josef-Muehlbauer-Platz 1, D - 93426 Roding