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TI 2270

Tape Inspection

 
 
 
 
 
 
 

Description

 
 

The Tape Inspection System TI 2270 is used to perform a fully automatic optical inspection of the glob tops on 35/super 35 mm tapes. These systems can be attached for in-line inspection to the encapsulation systems CME 3010 or can be operated as stand-alone systems for off-line quality control.

 

The new highlight of TI 2270 is the full dimension control of transparent glob tops as well as black globe tops with visual bleed out with high precision optical measurement of position and size as well as mechanical thickness measurement for height control.

 

The correct glob top is the focus of the TI 2270. Typical backside production failures can be detected: Incomplete fill, incomplete dam, exposed wires, bleeding, tape surface around the glob top, defected transparent holes, tape connecting.

 

The front side (surface) of the tape can be controlled at the same time for:

- Surface defects on the contact areas like scratches, fingerprints, contamination,...

 
 

 
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Last modified:08/04/2010
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