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FCM 10000

Flip chip bonding

 
 
 
 
 
 
 

Description

 
 

The Mühlbauer high speed Flip Chip Mounter FCM 10000 excels with its compact design and its high output yield and excellent cost-efficiency.

 

The FCM 10000 assembles the module tapes with chips directly from the wafer by means of the proven flip chip technology.

 

Despite the placing accuracy of ± 20 µm, a capacity of 10,000 UPH can be achieved, the equivalent of an annual capacity of 50 million modules.

 

Optionally the modules can be laminated in order to increase their mechanical strength as well as to allow the mounting of an electrical insulation.

 
 

 
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Last modified:08/09/2010
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